NEW APPROACH FOR TESTING AND MODELLING OF FATIGUE BEHAVIOUR

NEW APPROACH FOR TESTING AND MODELLING OF FATIGUE BEHAVIOUR

Reiser, J.; Maier, B.; Gänser, H.-P.; Guster, Ch.; Pippan, R.

Full Article:

The aim of this work is the investigation of damage evolution of materials under single step and variable amplitude loading in tests and corresponding simulations. Approaches for fatigue lifetime and fatigue limit prediction at the mesoscopic scale incorporate microstructure and grain features. This micromechanical approach coupled with polycrystalline plasticity should be able to take into account the contribution of grain orientation, grain shape, crystallographic orientation, as well as the influence of material defects. For the purpose of studying local plastic strain accumulation and therefore fatigue behavior at higher load cycles a new test rig for SEM in-situ tension-compression testing was developed by using finite element simulation coupled with topology optimization. Oxygen free high conductivity (OFHC) polycrystalline copper material with nearly uniform grain size distribution and no preferred grain orientation was chosen for the experimental investigations within this work. A simulation model of the chosen OFHC polycrystalline copper was set up. The model incorporates crystal plasticity with randomly distributed grain orientation and nearly uniform grain size distribution to match the properties of the tested specimens. Due to the high purity of OFHC copper the influence of grain boundaries can be neglected in the first phase of simulation. First simulation results are shown.

The aim of this work is the investigation of damage evolution of materials under single step and variable amplitude loading in tests and corresponding simulations. Approaches for fatigue lifetime and fatigue limit prediction at the mesoscopic scale incorporate microstructure and grain features. This micromechanical approach coupled with polycrystalline plasticity should be able to take into account the contribution of grain orientation, grain shape, crystallographic orientation, as well as the influence of material defects. For the purpose of studying local plastic strain accumulation and therefore fatigue behavior at higher load cycles a new test rig for SEM in-situ tension-compression testing was developed by using finite element simulation coupled with topology optimization. Oxygen free high conductivity (OFHC) polycrystalline copper material with nearly uniform grain size distribution and no preferred grain orientation was chosen for the experimental investigations within this work. A simulation model of the chosen OFHC polycrystalline copper was set up. The model incorporates crystal plasticity with randomly distributed grain orientation and nearly uniform grain size distribution to match the properties of the tested specimens. Due to the high purity of OFHC copper the influence of grain boundaries can be neglected in the first phase of simulation. First simulation results are shown.

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DOI: 10.5151/meceng-wccm2012-18609

Referências bibliográficas

• [1] F. Barbe, L. Decker, D. Jeulin, G. Cailletaud, “Intergranular and intragranular behavior of polycrystalline aggregates”. Part 1: F.E. model, International Journal of Plasticity 17, 513- 536, 2001
• [2] F. Barbe, S. Forest, G. Cailletaud, “Intergranular and intragranular behavior of polycrystalline aggregates”. Part 2: Results, International Journal of Plasticity 17, 537-563, 2001
• [3] C. Gérard, F. N’Guyen, N. Osipov, G. Cailletaud, M. Bornert, D. Caldemaison, “Comparison of experimental results and finite element simulation of strain localization scheme under cyclic loading”. Computational Materials Science 46, 755-760, 2009
• [4] A. Musienko, A. Tatschl, K. Schmidegg, O. Kolednik, R. Pippan, G. Cailletaud, “Threedimensional finite element simulation of a polycrystalline copper specimen”. Acta Materialia 55, 4121-4136, 2007

Como citar:

Reiser, J.; Maier, B.; Gänser, H.-P.; Guster, Ch.; Pippan, R.; "NEW APPROACH FOR TESTING AND MODELLING OF FATIGUE BEHAVIOUR", p-1982-1989. In: In Proceedings of the 10th World Congress on Computational Mechanics [= Blucher Mechanical Engineering Proceedings, v. 1, n. 1]. São Paulo: Blucher, 2014.
ISSN 23580828, DOI 10.5151/meceng-wccm2012-18609